- All sections
- B - Performing operations; transporting
- B22F - Working metallic powder; manufacture of articles from metallic powder; making metallic powder; apparatus or devices specially adapted for metallic powder
- B22F 1/107 - Metallic powder containing lubricating or binding agents; Metallic powder containing organic material containing organic material comprising solvents, e.g. for slip casting
Patent holdings for IPC class B22F 1/107
Total number of patents in this class: 100
10-year publication summary
0
|
0
|
0
|
0
|
3
|
9
|
17
|
22
|
37
|
14
|
2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
Hewlett-Packard Development Company, L.P. | 28538 |
5 |
Dowa Electronics Materials Co., Ltd. | 610 |
5 |
Mitsui Mining & Smelting Co., Ltd. | 1373 |
4 |
Resonac Corporation | 2233 |
4 |
Seiko Epson Corporation | 18724 |
3 |
Kao Corporation | 4843 |
3 |
Alpha Assembly Solutions Inc. | 189 |
3 |
Xtpl S.A. | 52 |
3 |
BASF SE | 19740 |
2 |
Fujitsu Limited | 19265 |
2 |
Lawrence Livermore National Security, LLC | 1834 |
2 |
Nichia Corporation | 3394 |
2 |
Material Concept, Inc. | 28 |
2 |
Mitsubishi Materials Corporation | 2378 |
2 |
Osaka Soda Co., Ltd. | 219 |
2 |
Tanaka Kikinzoku Kogyo K.K. | 589 |
2 |
Xjet Ltd. | 46 |
2 |
Element Six (UK) Limited | 178 |
2 |
Nantong T-sun New Energy Co.,Ltd. | 41 |
2 |
Ningbo Jinji Strong Magnetic Material Co., Ltd. | 2 |
2 |
Other owners | 46 |